Korea
 
DDR2-667 Micro-DIMM
 

256MB / 512MB / 1GB
 
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DDR2 is the next-generation evolution of DDR memory technology. DDR2 memory features faster speeds, higher data bandwidths, lower power consumption and enhanced thermal performance. DDR2 memory chips will be available in Fine-pitch BGA (FBGA) chip packages for improved electrical and thermal characteristics. In addition, DDR2 memory chips will incorporate On-Die Termination (ODT) to minimize memory signal reflections at high speeds, thereby improving timing margins. DDR2 memory chips will come in capacities up to 4 Gigabits, allowing for higher-capacity modules.

The Module is DDR2-667 CL5 Micro DIMM. The Module density from 256MB to 1GB, it consists DDR2-667MHz Synchronous DRAMs in FBGA packages, Memory Module intented for mounting into 214-pin sockets.

 
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